Electrolyte Tin Plating on PCB - Forum for Electronics

Hi all...
I have a issue regarding tin plating on PCB's.
I am making PCB boards since long for my personal use but the copper on the PCB gets oxidized very quickly, so i am planing to tin plate the PCB. i have even tried electrolyte tin plating on PCB's but the traces peels out when the PCB is put in etching chemical (FERRIC CHLORIDE). let me explain you the complete process of my PCB manufacturing with TIN plating.
1) Clean the PCB with soft iron wool.
2) TIN plate the PCB.
3) Paste the LPISM paste on the TIN Plated PCB and making a very thin layer (0.1mm)
4) Bake it at 120 degree Celsius for 10 to 12 minutes.
5) create a positive and put it in the UV exposure for 10 minutes.
6) put the TIN Plated PCB into the developer to remove unwanted pastes and the only thing remains on the board is the traces.
7) put the TIN plated PCB into Ferric Chloride solution to etch the remaining copper.
now when i put the TIN plated board into ferric chloride solution for etching, the TIN under the Traces(especially the border of traces) also gets etched but the copper remains unchanged.
why do TIN plating gets washed away when the PCB is put into the etching solution.
there are three layers on the board. base layer is copper and then TIN and then top layer is LPISM paste. but only the middle layer (TIN gets damaged leaving the rest of two layers unchanged.

Tin dissolves in Ferric Chloride.

The way I do it is to make the PCB first with plain copper traces then immerse it in warm tin plating solution for about 20 minutes. It leaves a deposit of tin on the copper which protects it and improves solderability. The Tin solution does not stick to the bare substrate or mask, only the exposed copper parts.

Brian.

The process which you use is called electoless tin plating which is very costly, and also not recommended for through hole plating (correct me if i wrong). And i am using a electolyte tin plating where even a small hole of 0.5mm is being plated.

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